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| Products | Single sided
Double sided
Multilayer boards
We accept orders for flex, alu core and other PCBs. | | Services | Prototypes
Boards from 2-8 layers
Series
| | Capabilities | | | Base Materials | FR-4, CEM-1, CEM-3
Thickness, mm
Cooper | 0.5, 0.8, 1.0, 1.2, 1.5, 2.0
18 µm, 35 µm, 50 µm, 70 µm |
Finish | Lead-free HAL
Hot air soldering leveling (HAL)
Copper plating std. |
Sn 99% Cu 1%
2-20 µm Sn 63%
min 20 µm |
| Surface finishes | Selective gold ( butt contacts):
Nickel
Gold |
5-7 µm
0.5-1.0 µm | | Innerlayer | Number of layers
Spacing
Thickness
Conductor Width
Conductor Spacing
Annular ring | Max. 8
min. 0,20 mm
min. 0.25 mm
min. 0,20 mm
min. 0,20 mm
min. 0,20 mm | | Outerlayer | Conductor Width
Conductor Spacing
Annular ring
Finished hole size | min. 0,15 mm
min. 0,15 mm
min. 0,15 mm
min. 0,2 mm | | Drilling | Hole size (finish)
Hole positioning | min. 0,25 mm
± 0,02 mm | | Solder mask | Imagecure
Roughness | > 20 µm
0.2 µm | | Component Notation | Min. line width
Min. High
Colours | 0,15 mm
1.8 mm
white, black | | Carbon printing | Min. spacing
Min. track
Thickness | 0,3 mm
0,3 mm
15 - 30 µm | | Peelable mask | Tolerance
Min. width
Min. distance to solder | ± 0,5 mm
0,5 mm
2,0 mm | | V-cut | Angle
Thickness (board) | 30°
min 0,8 mm | | E-testing | EMMA Flying Probe tester | | | Approvals | ISO - approval, quality
UL-approval | 9001
UL94V0 |
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