PCB TECHNOLOGY

Tooling
Design, to establish programs and software for the production equipment.

Cutting
Cut to size laminate and prepare according to customer’s order

Exposure of innerlayer
To transfer the image of the pattern to the innerlayer.
The exposure takes place in climat controlled yellow rooms with automatic machinery.

Etching of innerlayer
To develope the pattern by removing all unwanted copper.

Optic inspection of innerlayer
AOI to inspect the pattern before lamination.

Lay-up & pressing of innerlayer
To interleave the thin laminates and prepare sheets ind correct sequence. To insure correct layer-to-layer registration. To bond the "sandwich" into a rigid structure.

Drilling
To establish the hole pattern for electrical contact between layers. To permit mounting of components. To add registration holes for the production.

Electroless Copper
To make the surface in the holes conductive for the subsequent electroplating

Exposure
To transfer the image of the pattern for reacting as an negative plating resist.
The exposure takes place in a climat controlled yellow room.