PCB TECHNOLOGY

Tooling
Design, to establish programs and software for the production equoipment.

Cutting
Cut to size laminate and prepreg acording to customers order

Exposure of innerlayer
To transfer the image of the pattern to the innerlayer.
The exposure takes place in clima controlled yellow rooms with automatic machinery.

Etching of innerlayer
To develope the pattern by removing all unwanted copper.

Optic inspection of innerlayer
AOI to inspect the pattern before lamination.

Lay-up & pressing of innerlayer
To interleave the thin laminates and prepreg sheets ind correct sequence. To insure correct layer-to-layer registration. To bond the "sandwich" into a rigid structure.

Drilling
To establish the hole pattern for electrical contact between layers. To permit mounting of components. To add registration holes for the production.

Electroless Copper
To make the surface in the holes conductive for the subsequent electroplating

Exposure
To transfer the image of the pattern for reacting as an negative plating resist.
The exposure takes place in a clima controlled yellow room.